Premjeet Chahal

Premjeet Chahal
Born
India
Alma materIowa State University (B.S., M.S.)
Georgia Institute of Technology (Ph.D.)
Known forTerahertz electronics
Additive manufacturing
Electronics packaging
AwardsDARPA Young Faculty Award (2012)
IEEE Fellow (2024)
Scientific career
FieldsElectrical engineering
Microwave engineering
InstitutionsRaytheon (1999–2006)
Abbott Laboratories (2006–2008)
Michigan State University
National Science Foundation (rotator)
ThesisIntegral resistors and capacitors for mixed-signal packages using electroless plating and polymer-ceramic nanocomposites (1999)
Doctoral advisorMark G. Allen

Premjeet "Prem" Chahal is an Indian-American electrical engineer and professor in the Department of Electrical and Computer Engineering at Michigan State University. He is known for his research in terahertz and millimeter-wave electronics, additive manufacturing, and electronics packaging. He was elected a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2024 "for contributions to additive manufacturing and materials characterization."[1]

Education

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Chahal received his Bachelor of Science and Master of Science degrees in electrical engineering from Iowa State University.[2] He earned his Ph.D. in electrical engineering from the Georgia Institute of Technology in 1999.[2]

Career

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After completing his doctorate, Chahal worked as a senior researcher at Raytheon in Dallas, Texas from 1999 to 2006, where he conducted research in terahertz technologies, MMIC design, RF-MEMS, and sensors.[3] He then held a senior research position at Abbott Laboratories from 2006 to 2008, leading research in BioMEMS.[3]

Chahal joined Michigan State University as a faculty member in 2009.[2] He is a member of the Electromagnetics Research Group (EMRG)[4] and is affiliated with the Axia Institute.[3] Since 2021, he has served as a program director (rotator) at the National Science Foundation in the Engineering Directorate's Electrical, Communications and Cyber Systems (ECCS) division.[2]

Research

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Chahal's research interests include terahertz and millimeter-wave electronics, infrared sensors, microsystems packaging, RF-MEMS, BioMEMS, flexible electronics, and additive manufacturing.[4] His work on heterogeneous integration uses additive manufacturing (3D printing) to integrate different device technologies within single units, enabling applications in advanced packaging for computing, quantum systems, and communications.[2]

He has published over 250 refereed journal and conference papers and holds 13 U.S. patents.[2] According to Google Scholar, his work has been cited over 3,900 times.[5]

Awards and honors

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References

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  1. ^ a b "IEEE Fellows 2024". IEEE Microwave Theory and Technology Society. Retrieved January 1, 2026.
  2. ^ a b c d e f g h "Seminar: Premjeet Chahal". ECE Florida News. University of Florida. March 26, 2024. Retrieved January 1, 2026.
  3. ^ a b c "Axia Staff". The Axia Institute. Michigan State University. Retrieved January 1, 2026.
  4. ^ a b "Premjeet Chahal". Electromagnetics Research Group (EMRG). Michigan State University. Retrieved January 1, 2026.
  5. ^ "Premjeet Chahal". Google Scholar. Retrieved January 1, 2026.